The Road to embedded world: 4tlas to Present its Fuze Collection - Blog
February 10, 20254tlas will present its Fuze collection of purpose-built tools during embedded world 2025. The tools integrate into existing workflows delivering automation, speed, and order. By automating builds, traceability, and HiL testing workflows, Fuze reduces ineffectiveness, enabling a strong focus on building next generation devices. The Fuze collection consists of Fuze Build, Fuze Deliver, and Fuze Test.
The Road to embedded world: SEGGER Brings Five Key Areas for Efficiency and Reliability - Blog
February 10, 2025During embedded world 2025, SEGGER will showcase its portfolio with an exhibition of its five key areas of Create, Build, Debug, Verify, and Program. Visitors to booth 4-367 will explore how SEGGER tools enhance project efficiency and reliability.
ESA Backs Frontgrade Gaisler in Pioneering Ultra-Deep Sub-Micron Space Chip Development - News
February 07, 2025Gothenburg, Sweden. Under a new contract with the European Space Agency (ESA), Frontgrade Gaisler is heading a pioneering initiative to bolster Europe’s capabilities in semiconductor technology for space applications. The project focuses on developing breakthrough technology for highly sophisticated integrated circuits, using Ultra Deep Sub-Micron (UDSM) nodes as fine as 7nm.
Würth Elektronik to Showcase Cutting-Edge Electronics at embedded world - News
February 07, 2025Würth Elektronik will showcase its innovative Single Pair Ethernet (SPE) with Power over Data Lines (PoDL) concept at embedded world (Stand 2-110 in Hall 2) alongside advancements in wireless connectivity, power magnetics, optoelectronics, and electromechanics.
ONEKEY Report: German Industry Must Focus on Cyber Resilience in 2025 Amid Growing Vulnerabilities - News
February 06, 2025Duesseldorf, Germany. The German Federal Office for Information Security (BSI) states that more than 2,000 software vulnerabilities surface monthly, with about 15 percent marked as "critical." “In view of this constant threat situation, German industry should further strengthen its cyber resilience in 2025," commented Jan Wendenburg, CEO of the Duesseldorf-based cybersecurity company ONEKEY. The “OT+IoT Cybersecurity Report 2024” from his company suggests that last year, the industry did not adequately address software security in networked devices, machines, and systems.
Murata to Unveil Next-Gen Indoor Tracking and Connectivity Solutions at embedded world - News
February 06, 2025Murata Manufacturing Co., Ltd. will demonstrate its range of enhanced indoor assets at embedded world 2025. Murata will be located at booth 4A-646 where it will showcase how its module Type 1WL EVK and smart badges are utilized to track indoor assets and individuals as well as real-time tracking abilities combining precision, reliability, and low latency for an optimized user experience.
7Starlake’s PCIe104-RH: AI-Ready Embedded Computing with NVIDIA and Intel Power - News
February 05, 20257Starlake announced its PCIe104-RH, a cutting-edge PCIe/104 processing unit developed for extended performance and flexibility aimed at rugged, high-performance embedded environments. Leveraging Intel Core i7-13800HRE/HE processors and scalable framework, the PCIe104-RH is designed for applications in military, defense, unmanned systems, and C4ISR (Command, Control, Communication, Computers, Intelligence, Surveillance, and Reconnaissance) guaranteeing seamless operations of edge computing, and mission-critical workloads.
Solectrix and ASSDEV to Merge and Exhibit at embedded world 2025 - News
February 05, 2025During embedded world 2025, Solectrix will introduce the merging of the Solectrix Group (Solectrix GmbH and Solectrix Systems GmbH) with the ASSDEV Group (ASSDEV GmbH and AST-X GmbH). The merger is expected to utilize the manufacturing know-how of ASSDEV combined with Solectrix Systems knowledge of the fabrication and sales of complex electronic assemblies and systems.
dissecto's HydraLink Brings Cost-Effective and Efficient Automotive Ethernet to the Road - News
February 04, 2025The HydraLink is easing the transition from CAN-based networks to Automotive Ethernet by offering a USB3 Gen 1 to Automotive Ethernet interface that is thinner, cost-effective, and highly efficient. HydraLink connects directly from a PC to 100BASE-T1 and 1000BASE-T1 networks for real-time diagnostics, security testing, and protocol analysis aiding ECU development, penetration testing, and traffic interception for streamlining workflows.
Superior Sensor’s Innovative HV Series Sensor Optimizes EcoAir Valve Performance - News
February 04, 2025Los Gatos, California. Superior Sensor Technology announced deliveries of a customized HV Series differential pressure sensor for Triatek’s EcoAir Valve. The sensor for Triatek allows the EcoAir Valve to deliver up to seven pressure ranges with precision. This enables the valve to be utilized in various applications. The sensor’s support for various pressure ranges streamlines system design and manufacturing of the EcoAir Valve. It offers safety, reliability, and energy efficiency for critical environment HVAC environments.
GigaOm Awards Parasoft “Exceptional” Status in API Test Automation Report - News
February 03, 2025Parasoft received a leading position as a Leader and Fast Mover in the latest GigaOm Radar Report on API Functional Automated Testing. The recent Radar Report assessed 14 dedicated tools and platforms developed to validate API functionality, reliability, and performance.
AAEON Delivers AI Performance with BOXER-8654AI-KIT and Jetpack 6.0 Support - News
February 03, 2025Taipei, Taiwan. AAEON released its BOXER-8654AI-KIT, a development kit integrated with either an 8GB or 16GB NVIDIA Jetson Orin NX module. The kits’s module comes with an innovative carrier board highlighted with a full-function I/O including six USB 3.2 Gen 2 ports, an Out-of-Band (OOB) management box header, and four LAN ports with possible power boards for PoE capability.
VersaLogic's Sabertooth AI Sets a New Standard with Lightning-Fast Inferencing - News
January 31, 2025Tualatin, Oregon. VersaLogic Corp conducted tests and determined that its Sabertooth AI bests the NVIDIA Jetson AGX Orin by bringing 25 times faster AI inferencing. Multiple performance benchmarks and testing protocols were used to assess the inferencing capabilities of the embedded AI platforms. The benchmarks simulated real-world AI workloads and evaluated how well a solution can process tasks like image recognition, object detection, and sensor data analysis.
SECO to Showcase Scalable AI-Ready HMIs at embedded world - News
January 31, 2025SECO will demonstrate early samples of its Modular Vision product line at embedded world 2025 (March 11 to 13 in Nuremberg, Germany) where it will exhibit its innovative products developed to alter how industries deliver smart interactive displays within machines and appliances. These Panel PCs, known as HMI (Human-Machine Interface) assemblies, provide a complete embedded computing platform with a display, eliminating the need for OEMs to invest in extensive development.
Syslogic’s RSA4NA Brings Robust AI Computing to Industrial and Automotive Applications - News
January 30, 2025Syslogic released a new rugged computer, its RSA4NA, based on the NVIDIA Jetson Orin Nano System-on-Modules (SoMs) unlocking innovations within generative AI models. After a software update, the platforms power consumption increases from 15 watts to 25 watts allowing the GPU to operate up to 1020 MHz and 67 TOPs.
EdgeCortix Inc.'s SAKURA-I AI Accelerator Demonstrates Radiation Resilience, Advancing AI-Driven Space Exploration - News
January 30, 2025Tokyo, Japan. EdgeCortix Inc. released information that its SAKURA-I AI Accelerator is capable for space exploration due to its enhanced radiation resiliency. To analyze EdgeCortix’s AI accelerator’s radiation resistance, NASA Electronic Parts and Packaging Program (NEPP) performed a two-stage test, involving exposure to proton and heavy ion radiation in space-like conditions.
Molex’s MMCX Power over Coax Solution Ensures Secure and Stable Connections - News
January 29, 2025Lisle, Illinois. Molex has released its MMCX Power over Coax (PoC) solution delivering a patent-pending connecting technique to ensure secure and stable bonds while sustaining electrical ground stability. The solution is suited for compact needs where dependable RF connections and constant power delivery are essential including automotive liquid-crystal display (LCD) mirrors, driver monitoring systems, and industrial sensors.
Next-Gen Longsys eMMC Optimizes Space and Performance for AI Devices - News
January 29, 2025Longsys introduced a 7.2mm × 7.2mm subsize eMMC, that delivers an innovative memory solution for enhancing the physical space of AI wearables. According to the press release, it is one of the smallest subsize eMMCs presently offered. 153 solder balls virtually cover the entirety of the panel.
Cadence Bolsters IP Portfolio with Secure-IC Acquisition, Closing Expected in 2025 - News
January 27, 2025San Jose, California. Cadence has agreed to acquire Secure-IC enabling it to enhance Cadence’s range of innovative silicon-proven IP, including interface, memory, AI/ML, and DSP solutions. Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence commented, “We continue to invest in our comprehensive IP and design services portfolio to provide more complete system solutions for our customers.”
Cincoze’s DC-1300 Series Delivers Rugged Computing for Smart Manufacturing and Energy Management - News
January 27, 2025Cincoze released a new addition to its rugged computing DIAMOND product line, the Entry Performance & Compact industrial computer DC-1300 series. It leverages an Alder Lake-N platform Intel Core i3-N305 processor, with support for essential I/O interfaces for industrial applications. The DC-1300 offers wireless transmission solutions such as Wi-Fi, 5G, GNSS, etc., in a 185 x 131 x 56.5 mm chassis.